Submit a Manuscript to the Journal
The Journal of Adhesion
For a Special Issue on
Advances in Adhesive Bonding: Mechanics, Interface Characterization, and Failure Assessment
Manuscript deadline
Special Issue Editor(s)
Xiao Han,
Dalian University of Technology, Dalian, China
hanxiao@dlut.edu.cn
Wandong Wang,
Northwestern Polytechnical University, Xi'an China
w.wang@nwpu.edu.cn
Sofia Teixeira de Freitas,
Instituto Superior Tecnico, Lisbon University, Portugal
sofia.teixeira.freitas@tecnico.ulisboa.pt
Advances in Adhesive Bonding: Mechanics, Interface Characterization, and Failure Assessment
The main objective of the “Advances in Adhesive Bonding: Mechanics, Interface Characterization, and Failure Assessment” Special Issue is to publish outstanding papers presenting cutting-edge advances in adhesive mechanics and interface characterization, as well as their engineering applications. Experimental, theoretical and numerical research covering structural joint design, fracture mechanics, and failure assessment are welcome. Contributions on emerging joint design methods and characterization technologies, such as adhesive bonding of additively manufactured and continuous fiber-reinforced composites, are highly encouraged. Additionally, studies on long-term durability, environmental degradation, and fatigue life in the design and manufacturing of bonded engineering components are highly encouraged.
Topics of interest include, but are not limited to:
- Design and manufacturing of advanced adhesively bonded joints
- Advanced characterization of adhesive interfaces by analytical, numerical and/or experimental techniques
- Mechanisms of failure and degradation under complex loading conditions
- Adhesive bonding of additively manufactured and continuous fiber-reinforced composites
- Fracture mechanics and fatigue damage modeling of bonded structures
- Joining of dissimilar materials and composite-to-metal bonding
- Testing methods and standards related to adhesive selection and performance management
- Multi-scale experimental and computational aspects in adhesive bonding
Submission Instructions
Only original manuscripts can be submitted, according to the ‘Instructions for authors’ published on The Journal of Adhesion.